Desain dan Analisis Kinerja Arsitektur Pendingin Cerdas untuk Mengurangi Panas Berlebih dan Korsleting pada Motherboard Laptop
DOI:
https://doi.org/10.64845/jistech.v1i2.85Keywords:
Keandalan Motherboard, Laptop Ter overheating, Manajemen Termal, Pencegahan Korsleting, Pendingin CerdasAbstract
Panas berlebih merupakan salah satu penyebab utama penurunan kinerja dan kegagalan perangkat keras pada sistem laptop, yang seringkali menyebabkan kerusakan listrik seperti korsleting pada motherboard. Studi ini menyajikan desain dan analisis kinerja arsitektur heatsink cerdas yang bertujuan untuk meningkatkan manajemen termal dan mengurangi korsleting akibat panas berlebih pada laptop. Arsitektur yang diusulkan mengintegrasikan geometri heatsink yang dioptimalkan, material dengan konduktivitas termal tinggi, dan pemantauan suhu cerdas untuk meningkatkan efisiensi pembuangan panas dalam kondisi beban kerja dinamis. Penelitian ini menggunakan metodologi gabungan simulasi termal, pengembangan prototipe, dan pengujian eksperimental. Analisis termal komputasional dilakukan untuk mengevaluasi distribusi panas, efisiensi aliran udara, dan pengurangan suhu dibandingkan dengan desain heatsink konvensional. Hasil eksperimental menunjukkan bahwa arsitektur heatsink cerdas secara signifikan mengurangi suhu operasi puncak dan menstabilkan kinerja termal, sehingga menurunkan risiko stres termal dan korsleting listrik akibat kelembapan pada motherboard. Lebih lanjut, desain yang diusulkan berkontribusi pada peningkatan keandalan sistem dan efisiensi energi tanpa meningkatkan batasan faktor bentuk, yang sangat penting untuk perangkat portabel modern. Temuan ini menunjukkan bahwa arsitektur heatsink cerdas menawarkan solusi yang menjanjikan untuk kontrol termal tingkat lanjut pada laptop dan memberikan dasar untuk pengembangan sistem manajemen termal cerdas di masa depan pada perangkat komputasi kompak.
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